November 3rd - SAVE THE DATE

General information

IMAPS Italy Workshop – High Reliability Packaging for Avionics, Aerospace & Defense

Join us for the upcoming IMAPS Italy Workshop dedicated to High Reliability Packaging for Avionics, Aerospace & Defense.

We invite researchers, engineers, and industry professionals to submit their abstract and contribute to a day of technical exchange on the latest developments in high-reliability electronic packaging.

November, 3rd 2026
Polytechnic University of Milan - Bovisa Consiglio Hall, Building BL25 - Via Lambruschini, 4

Topics include:

Hermetic & non-hermetic packaging
Rad-hard component packaging
Advanced packaging for weight reduction
Additive manufacturing & embedded passives
Photonics packaging
RF, microwave, radar & satellite communications
EMI/EMC shielding
Thermal management & power dissipation
Reliability and long-life electronic components

November 3rd - SAVE THE DATE

General information

IMAPS Italy Workshop – High Reliability Packaging for Avionics, Aerospace & Defense

📅 Abstract submission deadline: September 3rd

📧 Send your abstract to: [email protected]