ESTC 2016

September 13 – 16, 2016

World Trade Center, Grenoble, France

Organized by IEEE-CPMT since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications.

ESTC completes the triumvirate together with ECTC in the United States and EPTC in Singapore and thus supports the global community of electronics packaging engineers and scientists.

 

All the details are available on the Conference website