IMAPS-UK are pleased to announce a Call for Abstracts for MicroTech 2021 on the theme of Heterogeneous Integration – Packaging Future Microsystems. MicroTech 2021 will be held Online on Thursday 25 March 2021.
The main conference topics are based on the Heterogeneous Integration Roadmap produced by the IEEE-EPS, covering the following chapters:
- High Performance Computing and Data Centres
- Internet of Things (IoT)
- Medical, Health and Wearables
- Automotive
- Aerospace and Defence
- Mobile
- Single-Chip and Multi-Chip Integration
- Integrated Photonics
- Integrated Power Electronics
- MEMS and Sensor Integration
- 5G Communication
- Co-Design for Heterogeneous Integration
- Modelling and Simulation
- Materials and Emerging Research Materials
- Emerging Research Devices
- Test Technologies
- Supply Chain
- Security
- Thermal
- SiP and Module System Integration
- Interconnects for 2D and 3D Architectures
- Wafer Level Packaging
For more information, please click on the following link Heterogeneous Integration Roadmap
For further details please download MicroTech 2021 - Call for Abstracts (66 downloads)
Abstracts are due by Friday 18th December 2020.
Please submit your Abstract to