EMPC 2019 - Italy

22nd European Microelectronics an Packaging Conference (EMPC) & Exhibition

The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading event.

EMPC-2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 16^th to 19^th September at the Palazzo Dei Congressi, an ideal venue which includes excellent lecture auditoria, exhibition space and a great social venue. The event will be complemented by social events for which IMAPS has a great tradition.

See you in Pisa!

CONFERENCE WEBSITE: www.empc2019.org

Exhibitors & Sponsors at EMPC 2019 - Thank you!

• • AEMTEC GMBH

  • AJINOMOTO FINE-TECHNO USA CORPORATION

  • ASSOCIATION FOR PROMOTING ELECTRONICS TECHNOLOGY - IMAPS ROMANIA - R&D Village

  • ASE GROUP - Gold Sponsor

  • AUREL - Silver Sponsor

  • ATV TECHNOLOGIE GMBH

  • CYBER TECHNOLOGIES GMBH

  • DISCO HI-TEC EUROPE GMBH

  • ELECTRON MEC - Silver Sponsor

  • ELEXIND

  • F&S BONDTEC SEMICONDUCTOR GMBH

  • FONDAZIONE INPHOTEC - R&D Village

  • FRAUNHOFER IZM - R&D Village

  • GESTLABS

  • GLOBAL SMT&PACKAGING (Media Partner)

  • GS NANOTECH

  • HAIKU TECH Europe

  • IEEE

  • IMAPS

  • IT-FAB THE ITALIAN NETWORK FOR MICRO AND NANO FABRICATION - R&D Village

  • LABORATORIO NEST - SCUOLA NORMALE SUPERIORE - R&D Village

  • LINTEC Advanced Technologies Europe GmbH

  • MICROPAC

  • MICROSS COMPONENTS

  • MICROTEST

  • MICROTEST SRL

  • NAMICS EUROPE GMBH

  • NEOHM COMPONENTI - Silver Sponsor

  • OPTIM WAFER SERVICES

  • PACTECH - Silver Sponsor

  • SAES GETTERS

  • SET CORPORATION SA

  • SHT SMART HIGH TECH AB

  • STELLAR INDUSTRIES CORP

  • STMICROELECTRONICS - Gold Sponsor

  • TAIPRO ENGINEERING

  • XYZTEC BV

  • ZUKEN SRL - Silver Sponsor