EMPC2017 - 10-13 settembre

The forthcoming EMPC 2017 will build on the successful forerunning EMPCs – the latest were in Germany (2015) and France (2013) – to benefit exhibitors and technical contributors. EMPC brings together the entire microelectronics supply chain, technical and marketing professionals from around the world.

Organized by IMAPS Poland

Venue: Main Hall of Warsaw University of Technology

Important dates

• March 31st 2017 – Deadline for abstract submission
• May 15th 2017 - Notification of acceptance
• June 30th 2017 – Deadline for full paper submission

Conference topics

• Advanced packaging and interconnects
• Electronics components assembly and PCB solutions
• Materials and processes
• Printed, hybrid and flexible electronics
• Modeling, design test & reliability
• Functional systems (actuators, sensors, photovoltaics and related)

CALL FOR PAPERS available on the Conference Website