15‐18 settembre 2020: ESTC 2020

As a response to the pandemic COVID-19 situation, ESTC 2020 moves to a 100% virtual platform, and the conference will be carried out live! You are therefore welcome to attend, independent of what travel restrictions may apply in September. The live format will allow interaction similar to an in-person conference. The digital format will give new possibilities, such as recording of presentations allowing to catch up presentations in parallel sessions.

While the Executive Committee regrets that we cannot this time welcome you physically to beautiful Vestfold and the “Electronic Coast” of Norway, we are delighted to welcome you to an innovative, high-quality and broad-reaching ESTC 2020, 15-18 September!

Details about registration are expected to be available before the end of June 2020.

Official website: www.estc-conference.net


About ESTC

Organized by IEEE-EPS (former CPMT) since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications.

ESTC completes the triumvirate together with ECTC in the United States and EPTC in Singapore and thus supports the global community of electronics packaging engineers and scientists.


The IEEE Electronic Components and Technology Conference (ECTC) is the leading conference in the field of electronic packaging since nearly 70 years. ECTC, organized by IEEE-EPS, is held yearly in US. 


Since 1997 a counterpart to ECTC has been introduced in Asia, the Electronics Packaging Technology Conference (EPTC), which is held every year in December in Singapore. EPTC is the leading flagship conference of IEEE-EPS in Region 10.

Co-operation with IMAPS Europe

Starting with the 1st ESTC 2006 in Dresden, Germany, the good co-operation between IEEE-EPS (former CPMT) and IMAPS (International Microelectronics Assembly and Packaging Society) in Europe has been continued. Both organizations agreed to organize their respective flagship conference in Europe alternately every two years. Thus ESTC is held every even year, while EMPC, the IMAPS event, is held every odd year.


The European Microelectronics and Packaging Conference (EMPC) is the major conference event organized by IMAPS Europe.