AUTUMN 2025 - Photonic Packaging

Date: 4 November 2025
In presence, Politecnico di MIlano
Submit your abstract to by August 25, 2025
Topics of interest include
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Packaging for Semiconductor lasers
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Modulators
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Silicon Photonics
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MEMS Micromirrors
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LEDs
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New materials for Photonics packaging
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Applications include Sensors, telecom and datacom
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Artificial intelligence
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Quantum computing
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Advance sensing
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Biophotonics
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Automotive lighting etc