5 November 2024 - Advanced Technology for Sensors

Advanced Technology for Sensors

When: 5 November 2024

Where: Politecnico of Milano Consiglio Hall - Building BL25 - Bovisa – Via Lambruschini 4, Milano 

IN PRESENCE

The event will be held in English

Registration is free but MANDATORY

> Register here <

Programme at a glance

• • Giorgio Ferrari, Politecnico di Milano, Italy

  Sensors in the new age of unconventional computing

  • Luca Maggi, STMicroelectronics, Italy

  Chip to package interaction for MEMS loudspeaker

  • Pierre-Damien Berger, CEA-Leti, France

  Pushing the boundaries of MEMS technology at CEA-Leti

  • Jens Müller, Technische Universität Ilmenau, Germany (online)

  LTCC and Silicon-Ceramic (SiCer) technology for sensor applications used under harsh environmental conditions

  • Evelyne A. Parmentier, Dyconex AG, Switzerland Francesco Bigelli, Somacis, Italy

  Functionalizing printed circuit boards by introducing alternative metals through sputtered layers

  • Jochen Schuermans, Roartis BV, Belgium

  “Green” chemistry for protection of high temperature (>250°C) electronics

  • Alberto Corigliano, Politecnico di Milano, Italy

  Recent advances in MEMS sensors and actuators

  • Pedro Alpuim, International Iberian Nanotechnology Laboratory, Braga, Portugal

  Chemical sensing with graphene liquid-gate transistors

  • Sajidul Qadir, Samsung, Germany

  Moisture sorption mechanism & diffusion modelling for non-hermetic microelectronic packages

  • Yucheng Zhang, Infineon, Germany

  Anodic bonding for TMPS sensors

  • Marcus Voitel, Fraunhofer IZM, Berlin, Germany

  Sensor packaging with integrated microfluidics for biosensors

  • Patrick Schirmer, DELO, Germany

  Pushing the limits of miniaturization in microelectronic packaging via the application of ultra-thin micro dam structures