4-5 November 2025 - Photonic Packaging
General Information
When: 4-5 November 2025
Where: Politecnico of Milano Consiglio Hall - Building BL25 - Bovisa – Via Lambruschini 4, Milano
IN PRESENCE
The event will be held in English
Registration is free but MANDATORY
> REGISTER HERE <
Program
Overview
Introduction
Andrea Melloni, Politecnico di Milano - Italy
From Chip to Product: Bridging the Gap with Photonic Packaging
Sabrine Mejri, Phix - The Netherlands
Packaging for Emerging Photonic Enabled Quantum Applications
Glenn George, Bay Photonics ltd - UK
Innovative Laser-Assisted Bonding Technology for Photonics Packaging Applications
Matthias Fettke, Pactech - Germany
A Versatile and Unified Software Platform for Precise Photonics Packaging Control
Gabriele Galeazzi, Visiorobotics - Italy
Adhesives for highly efficient optical coupling of Photonic Integrated Circuits
Alexander Hartwig, DELO - Germany
Photonic Glass Core Substrates for Data Centers and Optical Computing
Julian Schwietering, Fraunhofer Institute for Reliability and Microintegration IZM - Germany
Photonic Wire Bonds and Facet-Attached Micro-Lenses: Enabling Scalable Integration of Lasers and PICs
Laura Horan, Vanguard Automation GmbH - Germany
Glass micro-components for fiber connectivity in co-packaged optics and quantum photonics
Rolando Ferrini, FemtoPrint - Switzerland
Metallic Interconnects for Co-Packaged Photonic Integrated Circuits
Andrew Meek, Senko - UK
Optical PCBs as a Scalable Platform for High-Density Photonic Packaging
Nikolaus Flöry, Vario Optics - Switzerland
Single chip-DWDM External laser source for Co-packaged optics
John McCarthy, SCINTIL Photonics
Advanced Packaging enabling Photonics Module integration
Stéphane Bernabé, CEA Leti - France
Advanced Photonics Packaging – a key aspect for the ecosystem
Giorgio Cazzaniga, Jabil - Italy
AI-driven packaging strategies, including silicon photonics integration for high-performance computing and Network system
Roberto Dossi, ASE - Italy
Thin film deposition developments for Co-Packed Optics as next Heterogeneous Integration Evolution Step
Ewald Strolz, Evatec - Italy
Integrated Photonic Coupling Interfaces - Expectations and Challenges
Galina Georgieva, Axinora - Bulgaria
EPIQUS – Electronic-photonic integrated quantum simulator platform
Mher Ghulinyan, FBK - Italy
Industrial Packaging of photonic devices for telecom and DCI applications
Victor Guja, Nokia - Italy
Packaging Techniques for High-Speed TFLN devices
Alberto Rampulla, AFR - Italy
Free Space Optical communication for 5GA and 6G: Challenges, Opportunities, and Future Directions
Angelo Milani, Huawei - Italy
Introduction to multilayer glass interposers fabrication, suitable for Co-Packaged Optics and Quantum processor applications.
Giovanni Del Rosso, Phospack - Finland
Reliability Considerations on LCP Air-Cavity Packages for Photonics Integrated Circuits (PICs)
Marco H. Koelink, RJR Technologies - USA
Moisture Control in Photonic Packages: an Experimental Study for Moisture prediction at Different Temperatures
Giovanni Zafarana, SAES Getters - Italy