13-16 September 2021 - EMPC2021

23rd Microelectronics and Packaging Conference & Exhibition

On behalf of the EMPC2021 Technical Committee, I would like to invite you to submit an abstract for the 23rd Microelectronics and Packaging Conference & Exhibition, that will take place from 13th to 16th September 2021 in Gothenburg, Sweden. To enable abstract submissions by as many colleagues as possible, the committee has extended the deadline for the submissions. The Extended deadline for submitting abstracts is Tuesday February 9th, 2021.

 

Submission deadline has been extended to Tuesday February 9th, 2021.

For instructions on how to submit, please go to http://empc2021.org/call-for-papers/

 

TOPICS:

Advanced Packaging
  • 3D integration,
  • System-in Packages,
  • FI- and FO-WLP
  • Innovative interconnects
  • Circuit solutions
  • Panel level packaging
  • Substrate and Interposer Technologies
  • Emerging Heterogeneous Integration Technologies
Advanced packaging for MEMS & sensors
  • Sensors
  • Actuators and RF systems
Electronics Reliability & Quality
  • Methodology
  • Predictive maintenance
  • Novel reliability test methods
  • Modelling
  • Statistical reliability analysis and life models
  • Failure analysis and material characterization
Green Technologies
  • Recycling
  • Supply chain
  • Low power computing
 Harsh environment applications
  • Aerospace
  • Automotive
  • Rail
  • Washable wearables
  • Smart farming
  • Drilling
  • HTHP (high temperature and high pressure) O&G wells
  • Geothermal energy and process industry
Materials & Processes
  • Manufacturing and assembly technologies
  • New materials
  • Compatibility
  • Enabling materials
  • Nano-materials and processes
Medical electronics
  • Implantable devices
  • Miniaturization
  • Neural interfaces
  • Validation
  • New trends
  • Reliability of implanted electronics
  • Sensors for (implantable) medical devices
 		 Opto-electronics
  • Packaging
  • Light sources
  • Detectors
  • Photonic integrated circuits based on III-V/Si technology platforms
  • Emerging materials
  • Applications
Power electronics
  • Packaging
  • Thermal management
  • Wide Bandgap applications
  • Energy-conversion technologies
Printed electronics
  • Materials and processes
  • Flexible
  • Structural
  • Applications (automotive, energy, medical, wearable and others)
 

 

Covid19 statement

 

We are continuously monitoring the Covid19 situation with regards to how EMPC-2021 will be organised in September this year. The situation is currently extremely challenging as most countries are experiencing a second wave of infections. Even with promising news of vaccines, combating the Covid19 virus will still demand social distancing for some time to come, which sadly is not fully compatible with organising a conference.

 

At this time, the EMPC-2021 committee is cautiously optimistic and thus still planning on a face-to-face conference in Gothenburg. However, as a back-up we are also doing preparations in case the conference will have to be online only. In that case, we have chosen a solution called Trippus and will be organised by Meetx, that manages the conference secretariat. In our view, this solution will still enable social networking, both for participants, speakers and exhibitors. A presentation of the solution can be found at www.trippus.com.

 

To avoid unnecessary administration related to refunding parts of the registration fee to the conference, the registration will first require a reservation fee that is set to about 30% of the cost of the face-to-face conference. If the conference goes online, the reservation fee will cover the full registration at the online event. The reservation fee is non-refundable. If the conference is face-to-face, participants and exhibitors will have to pay the remaining registration fee before the conference.

 

The EMPC-2021 committee targets making the decision whether to go face-to-face or online in April 2021 at the latest.

 

We hope you appreciate the committee’s transparency regarding these decisions.

 

Stay safe and see you at EMPC2021!

 

Daniel Nilsen Wright                                                    Heidi Lundén

General Chair of EMPC 2021                                     Technical Chair of EMPC 2021

President of IMAPS Nordic                                         Vice President of IMAPS Nordic

 

www.empc2021.org 

https://nordic.imapseurope.org/