EMPC 2019 - Italy
Imaps Italy takes great pleasure in inviting you to attend and to submit an abstract for EMPC2019 which will be held in the High Tech and charming Tuscan city of Pisa from September 16 to 19, 2019.
This major European microelectronics packaging conference will cover a wide spectrum of technological topics for microelectronics field including advanced packaging, power packaging, photonic, sensor packaging, bio-medical , automotive and aerospace/defence electronics.
Throughout the Conference a major Exhibition will allow the attendants to meet the key players of the Industry and Academia
A Social Programme will give you the opportunity for important networking as well as to explore the Tuscan historical and natural beauty .
See you in Pisa!
Download the first announcement below