18‐20 settembre: ESTC 2018
Organized by IEEE-EPS (former CPMT) since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications.
ESTC completes the triumvirate together with ECTC in the United States and EPTC in Singapore and thus supports the global community of electronics packaging engineers and scientists.
The IEEE Electronic Components and Technology Conference (ECTC) is the leading conference in the field of electronic packaging since nearly 70 years. ECTC, organized by IEEE-EPS, is held yearly in US.
Since 1997 a counterpart to ECTC has been introduced in Asia, the Electronics Packaging Technology Conference (EPTC), which is held every year in December in Singapore. EPTC is the leading flagship conference of IEEE-EPS in Region 10.
Co-operation with IMAPS Europe
Starting with the 1st ESTC 2006 in Dresden, Germany, the good co-operation between IEEE-EPS (former CPMT) and IMAPS (International Microelectronics Assembly and Packaging Society) in Europe has been continued. Both organizations agreed to organize their respective flagship conference in Europe alternately every two years. Thus ESTC is held every even year, while EMPC, the IMAPS event, is held every odd year.
The European Microelectronics and Packaging Conference (EMPC) is the major conference event organized by IMAPS Europe.