17th
EUROPEAN MICROELECTRONICS and PACKAGING
CONFERENCE & EXHIBITION - EMPC 2009
June 15th -18th, 2009 - Rimini - Italy
www.empc2009.org
The
aim of IMAPS is to take to Rimini, one of the most renowned bathing
resort towns in Italy, the best of Microelectronics and Packaging,
thus offering a top quality coverage of technological innovation
related to microelectronic packaging and Interconnection technologies.
The four day Conference and Exhibition will be held from 15th
to 18th June 2009 at Palacongressi in Rimini. It will be complemented
by Advanced Professional Courses and by poster sessions.
CONFERENCE:
CALL FOR PAPERS
You
are cordially invited to submit a
paper on Microelectronics Packaging Technologies, for oral or
poster presentation at the Conference on the following topics:
ADVANCED PACKAGING:
Single Chip and Multi Chip Packaging, Wafer Level Packaging, 3D-WLP,
3D-IC, SIP, SOP and other System Integration Technologies; - Embedded
Passives on Wafers and Substrates; - High Frequency and High Power
Packaging; - LTCC Ceramics Technologies; - PCB and BGA Substrates
Design and Technologies, Laminates, Micro-Vias and Build-Up Technologies,
Flex, MID.
INTERCONNECTION TECHNOLOGIES:
Thick and Thin Film Technologies; - Wire Bonding, Bumping, Flip
Chip Bonding; - Cu/Low-k Wafers, Through Silicon Vias; - Lead-Free
Soldering and Adhesive Joining.
MORE THAN MOORE:
MEMS Packaging: MEMS Based Sensors and Actuators Packaging, RF-MEMS,
Optical MEMS and Bio-MEMS; - Optoelectronics: Power LED Packaging
and Light Guiding, Packaging of Optoelectronic Modules suitable
for Gb/s Fiber Optic Communication; - Solar Energy (Photovoltaics):
Packaging Design to improve Efficiency of Photovoltaic modules
Reliability and Qualification Approaches; - Nano Technologies:
Smart Materials, Interconnections, Nano-Scale Packaging; - Medical
Electronics: Applications, Design, Development, Manufacturing
that comply with complex and demanding regulations and market
requirements.
POWER ELECTRONICS:
Application in Consumer, Telecom, Automotive, Wearable, Space
and Defence.
MANUFACTURING TECHNOLOGIES AND MATERIALS:
Process Development, New Equipment, Yield Improvement, Cost and
Cycle Time Reduction, Green Manufacturing; - Adhesives, Encapsulants,
Underfills, Moulding Compounds, Lead-Free Solder Alloys, Halogen
Free Materials, Dielectrics and Ceramics.
MODELLING:
Electrical Modelling and Signal Integrity: Time and Frequency
Domain Analysis of Interconnection and Packaging Technologies;
- Thermal Characterisation and Cooling Solutions: Modelling and
Simulation Methodology for Characterisation of Advanced Packaging,
Modules and Systems, Novel Cooling Techniques; - Mechanical Modelling
and Structural Integrity: Thermo-Mechanical Stress Analysis, Vibration
and Shock Tests; - Quality and Reliability: Component, Board and
System Level Reliability Assessment, Failure Analysis, Interfacial
Adhesion and Accelerated Testing Methods.
CALL
FOR PAPERS (Deadline for submission: December 31st 2008)
If you wish to present a paper for oral or poster presentation
at the 17th European Microelectronics and Packaging Conference
please contact Pragma Congressi - C.so Mazzini, 14 - 27100 Pavia
- Italy - Tel. +39 0382 309579 - Fax +39 0382 304892 - E-mail:
segreteria@empc2009.org
or visit www.empc2009.org
EXHIBITION
Throughout the Conference there will be a major exhibition that
will allow the conference attendants to meet and discuss with:
Material Suppliers - Manufacturers of equipment and products for
Hybrid Microelectronics and MCMs - Component Suppliers - Manufacturers
of Hybrids and Packages - Suppliers of Test and Analysis Equipment
and Services - Academia and R&D Laboratory People.
A
special "Exhibition forum" in parallel with the conference
sessions enabling exhibitors to illustrate the technical novelties
of their products.
visit
www.empc2009.org
Chi
è IMAPS
IMAPS
(International Microelectronics and Packaging Society) è un'associazione
indipendente senza profitto, il cui scopo è il progresso e la
diffusione nel mondo delle conoscenze relative alla Microelettronica.
Questa rappresenta la tecnologia chiave nel montaggio e nell'applicazione
dei semiconduttori al silicio, dei circuiti a film spesso e sottile
su substrati in ceramica, del packaging, dei circuiti stampati,
dell'assemblaggio di schede elettroniche per costruire dispositivi
elettronici miniaturizzati e per realizzare l'equipaggiamento
relativo.
La società ha Chapters in molti paesi del mondo, in particolare,
in ordine alfabetico:
Benelux, Brasile, Cina, Corea, Francia, Germania, Giappone, India,
Israele, Italia, Malesia, Polonia, Regno Unito, Romania, Repubblica
Ceca e Repubblica Slovacca, Russia, Scandinavia, Singapore, Slovenia,
Stati Uniti, Taiwan, Ungheria.
Gli
iscritti all'associazione sono circa 11.000 in tutto il mondo.
Leggi i vantaggi cui si accede mediante
l'iscrizione
a IMAPS Italy o scrivi a infotiscali@imaps-italy.it
CONFERENCE
SECRETARIAT
IMAPS
ITALY
Corso Mazzini, 9 - 27100 Pavia
Phone: +390382309579
Fax: +390382304892
E-mail: infotiscali@imaps-italy.it
(web site: www.imaps-italy.it)